Electronic package structure

ABSTRACT

An electronic package structure including at least one first electronic element, a second electronic element and a lead frame is provided. The second electronic element includes a body having a cavity. The first electronic element is disposed in the cavity. The lead frame has a plurality of leads. Each of the leads has a first end and a second end. The first end of at least one of the leads extends to the cavity to electrically connect the first electronic element.

CROSS-REFERENCE TO RELATED APPLICATION

This application claims the priority benefit of Taiwan applicationserial no. 97105555, filed on Feb. 18, 2008. The entirety of theabove-mentioned patent application is hereby incorporated by referenceherein and made a part of specification.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a package structure. More particularly,the present invention relates to an electronic package structure.

2. Description of Related Art

Electronic package structures are formed by complicated packageprocesses. Different electronic package structures have differentelectrical performances and capacities of heat dissipation, andtherefore a designer may select an electronic package structure with adesired electrical performance and capacity of heat dissipationaccording to a design requirement.

FIG. 1 is a schematic diagram of a conventional electronic packagestructure. Referring to FIG. 1, the conventional electronic packagestructure 100 includes a printed circuit board (PCB) 110 and a pluralityof electronic elements 120. The electronic elements 120 are disposed ona surface 112 of the PCB 110 and electrically connected to the PCB 110.The PCB 110 has a plurality of pins 116 extending out from anothersurface 114 of the PCB 110 to be electrically connected to an electronicdevice, for example, a motherboard (not shown).

FIG. 2 is a schematic diagram of another conventional electronic packagestructure. Referring to FIG. 2, the conventional electronic packagestructure 200 includes a circuit substrate 210 and a plurality ofelectronic elements 220. The electronic elements 220 are disposed on asurface 212 of the circuit substrate 210, and electrically connected tothe circuit substrate 210 via a wire bonding technology, a flip-chipbonding technology or a surface mount technology. Moreover, theconventional electronic package structure 200 may be electricallyconnected to an electronic device, for example, a motherboard (notshown), via a solder paste or a plurality of solder balls (not shown).

It should be noted that the electronic elements 120 of the conventionalelectronic package structure 100 are all disposed on the surface 112 ofthe PCB 110, and the electronic elements 220 of the conventionalelectronic package structure 200 are all disposed on the surface 212 ofthe circuit substrate 210. Therefore, in the conventional electronicpackage structures 100 and 200, spatial utilization of the PCB 110 andthe circuit substrate 210 is relatively low, and sizes of theconventional electronic package structures 100 and 200 are relativelygreat.

SUMMARY OF THE INVENTION

In accordance with the present invention, an electronic packagestructure can achieve a relatively high utilization of an internal spacethereof, so that a size of the electronic package structure can bereduced.

In one embodiment of the present invention, an electronic packagestructure includes at least a first electronic element, a secondelectronic element and a first lead frame. The second electronic elementincludes a body having a cavity. The first electronic element isdisposed in the cavity. The lead frame has a plurality of leads. Each ofthe leads has a first end and a second end, and the first end of atleast one of the leads extends to the cavity to electrically connect thefirst electronic element.

In one embodiment of the present invention, an electronic packagestructure includes at least one first electronic element, a secondelectronic element and a lead frame. The second electronic elementincludes a body having a first surface. The lead frame has a pluralityof leads. Each of the leads has a first end and a second end. The firstends are disposed on the first surface, and the first electronic elementis disposed on the first surface and electrically connected to at leastone of the leads.

In one embodiment, an electronic package structure includes a circuitsubstrate, at least one first electronic element and a second electronicelement. The circuit substrate has a first surface. The first electronicelement is disposed on the first surface of the circuit substrate andelectrically connected to the circuit substrate. The second electronicelement is disposed above the first surface of the circuit substrate andincludes a body and a plurality of leads. Each of the leads has a firstend and second end, and the second end of each of the leads extends outfrom the body to electrically connect the circuit substrate. The firstelectronic element is located among the body of the second electronicelement, the first surface of the circuit substrate and the leads.

In the above embodiments of the present invention, since the firstelectronic element can be disposed in the cavity of the secondelectronic element or on the second electronic element, or the secondelectronic element can be stacked on the first electronic element,compared to the conventional electronic package structures, utilizationof an internal space of the electronic package structure is relativelyhigh.

In order to make the aforementioned and other objects, features andadvantages of the present invention comprehensible, a preferredembodiment accompanied with figures is described in detail below.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic diagram of a conventional electronic packagestructure.

FIG. 2 is a schematic diagram of another conventional electronic packagestructure.

FIG. 3A is a schematic diagram of an electronic package structureaccording to a first embodiment of the present invention.

FIG. 3B is a schematic diagram of another electronic package structureaccording to the first embodiment of the present invention.

FIG. 3C is a schematic diagram of another electronic package structureaccording to the first embodiment of the present invention.

FIG. 3D is a schematic diagram of still another electronic packagestructure according to the first embodiment of the present invention.

FIG. 4A is a schematic diagram of an electronic package structureaccording to a second embodiment of the present invention.

FIG. 4B is a schematic diagram of another electronic package structureaccording to the second embodiment of the present invention.

FIG. 5A is a schematic diagram of an electronic package structureaccording to a third embodiment of the present invention.

FIG. 5B is a schematic diagram of another electronic package structureaccording to the third embodiment of the present invention.

DESCRIPTION OF EMBODIMENTS First Embodiment

FIG. 3A is a schematic diagram of an electronic package structureaccording to a first embodiment of the present invention. Referring toFIG. 3A, the electronic package structure 300 includes at least onefirst electronic element 310 (two first electronic elements areillustrated in FIG. 3A), a second electronic element 320 and a firstlead frame 330. The electronic package structure 300 is generallyapplied to a voltage regulator module, a network adapter, a graphicsprocessing unit, a DC/DC converter or a point-of-load (POL) converter.Each of the first electronic elements 310 can be a logical controlelement, a driving element or a passive element. The passive element canbe a capacitor, an inductor with lesser inductance, or a resistor. Eachof the first electronic elements 310 can also be a power element, suchas a metal-oxide-semiconductor field effect transistor (MOSFET), aninsulated gate bipolar transistor (IGBT) or a diode.

The second electronic element 320 includes a body 322 having a cavity322 a. The first electronic elements 310 are disposed in the cavity 322a. In the embodiment, the body 322 of the second electronic element 320has a first surface 322 b, a second surface 322 c opposite to the firstsurface 322 b and a side surface 322 d. The cavity 322 a sinks in adirection from the second surface 322 c towards the first surface 322 b.The side surface 322 d connects the first surface 322 b and the secondsurface 322 c. Besides, the second electronic element 320 can be anenergy-storage element used for storing electric energy. In detail, thesecond electronic element 320 further includes a coil 324 and aplurality of first external electrodes 326. The coil 324 is disposedwithin the body 322. The first external electrodes 326 are respectivelyconnected to two opposite ends of the coil 324, and extend outside thebody 322 to locate on the first surface 322 b and the side surface 322d. The body 322 comprising a magnetic body encloses the coil 324. Thesecond electronic element 320 can be an inductive element with a greaterinductance and a greater size than the first electronic elements 310.

The first lead frame 330 has a plurality of leads 332. Each of the leads332 has a first end 332 a and a second end 332 b, and the first end 332a of each of the leads 332 can be embedded in the body 322 and extendsto the cavity 322 a for electrically connecting to the first electronicelements 310. The second end 332 b of each of the leads 332 is disposedon the first surface 322 b of the body 322 to form a second externalelectrode 332 c, and a part of each of the leads 332 connecting thefirst end 332 a and the second end 332 b is disposed on the side surface322 d of the body 322.

In the present embodiment, the electronic package structure 300 furtherincludes a circuit substrate 340 and an insulating encapsulant 350. Thecircuit substrate 340 is disposed in the cavity 322 a of the body 322.The first electronic elements 310 can be disposed on the circuitsubstrate 340 and electrically connected to the circuit substrate 340.The circuit substrate 340 is electrically connected to the first end 332a of each of the leads 332 extending to the cavity 322 a. The firstelectronic elements 310 may be electrically connected to the circuitsubstrate 340 via a wire bonding technology, a flip-chip bondingtechnology or a surface mount technology.

The circuit substrate 340 has a first circuit layer 342, a secondcircuit layer 344, a dielectric layer 346 disposed between the firstcircuit layer 342 and the second circuit layer 344, and at least aconductive channel 348. The first electronic elements 310 are disposedon the first circuit layer 342, and the conductive channel 348penetrates the dielectric layer 346 for electrically connecting thefirst circuit layer 342 and the second circuit layer 344. It should benoted that the circuit board 340 of the electronic package structure 300may be omitted according to a design requirement of a designer, thoughit is not illustrated.

Moreover, the insulating encapsulant 350 is disposed in the cavity 322 aand encapsulates the first electronic elements 310 and the circuitsubstrate 340 for protecting the first electronic elements 310 and thecircuit substrate 340, and enhancing a whole mechanical strength of theelectronic package structure 300.

Since the first electronic elements 310 and the circuit substrate 340are disposed in the cavity 322 a of the second electronic element 320,compared to a conventional electronic package structures of FIG. 1 andFIG. 2, utilization of an internal space of the electronic packagestructure 300 is relatively high, and the first electronic elements 310and the circuit substrate 340 can be protected by the cavity 322 a.Besides, since the insulating encapsulant 350 is disposed in the cavity322 a, material of the insulating encapsulant 350 can be directly filledinto the cavity 322 a without aiding of extra mold during formation ofthe insulating encapsulant 350.

FIG. 3B is a schematic diagram of another electronic package structureaccording to the first embodiment of the present invention. Referring toFIG. 3A and FIG. 3B, a difference between the electronic packagestructure 300′ and the electronic package structure 300 is that a partof each lead 332′ connecting a first end 332 a′ and a second end 332 b′penetrates a body 322′. Besides, the insulating encapsulant 350 of theelectronic package structure 300 is different from a magneticencapsulant 350′ of the electronic package structure 300′. The magneticencapsulant 350′ is disposed in a cavity 322 a′ of the body 322′.Therefore, if a second electronic element 320′ is an inductive element,an inductive characteristic of the second electronic element 320′influenced by the cavity 322′ then can be compensated by the magneticencapsulant 350′. It should be noted that a part of each of the leads332 connecting the first end 332 a and the second end 332 b may alsopenetrate the body 322 according to a design requirement, though it isnot illustrated.

FIG. 3C is a schematic diagram of another electronic package structureaccording to the first embodiment of the present invention. Referring toFIG. 3A and FIG. 3C, a difference between the electronic packagestructure 300″ and the electronic package structure 300 is that a cavity322 a″ of a body 322″ sinks in a direction from a first surface 322 b″towards a second surface 322 c″. It should be noted that an insulatingencapsulant 350″ can be substituted by a magnetic encapsulant accordingto a design requirement, and a part of each lead 332″ connecting a firstend 332 a″ and a second end 332 b″ may also penetrate the body 322″according to a design requirement, though it is not illustrated.

FIG. 3D is a schematic diagram of still another electronic packagestructure according to the first embodiment of the present invention.Referring to FIG. 3A and FIG. 3D, a second lead frame 360 is applied inthe electronic package structure 300′″ for substituting the circuitsubstrate 340 of the electronic package structure 300 according to adesign requirement. A plurality of first electronic elements 310′″ aredisposed on the second lead frame 360 and electrically connected to thesecond lead frame 360. The second lead frame 360 is electricallyconnected to a first end 332 a′″ of each lead 332′″ of a first leadframe 330′″ that extends to a cavity 322 a′″.

Second Embodiment

FIG. 4A is a schematic diagram of an electronic package structureaccording to a second embodiment of the present invention. Referring toFIG. 4A and FIG. 3A, a difference between the electronic packagestructure 400 of the second embodiment and the electronic packagestructure 300 of the first embodiment is that a body 422 of a secondelectronic element 420 does not have the cavity 322 a. In detail, afirst end 432 a of each lead 432 of a lead frame 430 is disposed on afirst surface 422 a of a body 422, and a plurality of first electronicelements 410 are disposed on the first surface 422 a and electricallyconnected to the leads 432. Moreover, a second end 432 b of each of theleads 432 is disposed on a second surface 422 b of the body 422 oppositeto the first surface 422 a, and a part of each of the leads 432connecting the first end 432 a and the second end 432 b is disposed on aside surface 422 c of the body 422.

Furthermore, a circuit substrate 440 is disposed on the first surface422 a and electrically connected to the leads 432, and the firstelectronic elements 410 are disposed on the circuit substrate 440 andelectrically connected to the circuit substrate 440. It should be notedthat the circuit substrate 440 of the electronic package structure 400may be omitted according to a design requirement of the designer, or thecircuit substrate 440 may be substituted by a lead frame, though it isnot illustrated.

FIG. 4B is a schematic diagram of another electronic package structureaccording to the second embodiment of the present invention. Referringto FIG. 4A and FIG. 4B, a difference between the electronic packagestructure 400′ and the electronic package structure 400 is that a partof each lead 432′ connecting a first end 432 a′ and a second end 432 b′penetrates a body 422′.

Third Embodiment

FIG. 5A is a schematic diagram of an electronic package structureaccording to a third embodiment of the present invention. Referring toFIG. 5A, in the electronic package structure 500 of the presentembodiment, a plurality of first electronic elements 510 are disposed ona first surface 532 of a circuit substrate 530 and electricallyconnected to the circuit substrate 530. A second electronic element 520is disposed above the first surface 532 of the circuit substrate 530.The first electronic elements 510 are located between a body 522 of thesecond electronic element 520 and the first surface 532 of the circuitsubstrate 530, and the first electronic elements 510 are located betweenleads 524 of the second electronic element 520. In other words, in thepresent embodiment, the second electronic element 520 covers the firstelectronic elements 510. Besides, an insulating encapsulant 540 isdisposed between the second electronic element 520 and the circuitsubstrate 530 and encapsulating the first electronic elements 510 forprotecting the first electronic elements 510 and enhancing a wholemechanical strength of the electronic package structure 500. Moreover,the circuit substrate 530 may further include at least a conductivechannel 539, and each of the conductive channels 539 penetrates adielectric layer 538 for electrically connecting a first circuit layer534 and a second circuit layer 536. At least one of the conductivechannels 539 (for example, the two conductive channels 539 located at aleft side of FIG. 5A) is located below at least one of the firstelectronic elements 510 (for example, the first electronic element 510located at the left side of FIG. 5A), so that heat generated by thefirst electronic element 510 located at the left side may be quicklytransmitted to where is outside the electronic package structure 500 viathe two conductive channels 539 located at the left side. A second end524 b of each of the leads 524 of the second electronic element 520extends out from the body 522 to electrically connect the circuitsubstrate 530. The second electronic element 520 may be an inductiveelement including a coil 526. The body 522 which is a magnetic wrapwraps the coil 526, and a first end 524 a of each of the leads 524 isconnected to one of two opposite ends of the coil 526.

It should be noted that the electronic package structure 500 furtherincludes an electromagnetic-interference-shielding element(EMI-shielding element) 550 covering the first electronic elements 510.In the present embodiment, the EMI-shielding element 550 is disposed onthe body 522 of the second electronic element 520, and is locatedbetween the body 522 of the second electronic element 520 and thecircuit substrate 530. Therefore, during operation of the electronicpackage structure 500, it may be reduced by means of the EMI-shieldingelement 550 that electrical signals transmitted in the circuit substrate530 is interfered by a magnetic force generated by the second electronicelement 520 which functions as an inductive element.

FIG. 5B is a schematic diagram of another electronic package structureaccording to the third embodiment of the present invention. Referring toFIG. 5A and FIG. 5B, a difference between the electronic packagestructure 500′ and the electronic package structure 500 is that anEMI-shielding element 550′ of the electronic package structure 500′ isdisposed in a cavity 522′ of a second electronic element 520′.

In summary, in the aforementioned embodiments of the present invention,since the first electronic elements can be disposed in the cavity of thesecond electronic element or can be disposed on the second electronicelement, or the second electronic element can be stacked on the firstelectronic elements, compared to the conventional electronic packagestructures, utilization of an internal space of the electronic packagestructure is relatively high, so that a size of the electronic packagestructure can be reduced.

It will be apparent to those skilled in the art that variousmodifications and variations can be made to the structure of the presentinvention without departing from the scope or spirit of the invention.In view of the foregoing, it is intended that the present inventioncover modifications and variations of this invention provided they fallwithin the scope of the following claims and their equivalents.

1-13. (canceled)
 14. An electronic package, comprising: a substrate; atleast an electronic element on top of the substrate; a coil; a bodyencapsulating at least said coil and being positioned on top of saidelectronic element; and a pair of leads each having a top endelectrically coupled to a respective end of the coil, a bottom endelectrically coupled to the substrate, and a middle section connectingsaid top end and said bottom end to define a bracket shape.
 15. Anelectronic package as claimed in claim 14, wherein the electronicelement is disposed on a top face of the substrate between the bottomends of the leads.
 16. An electronic package as claimed in claim 14,wherein said middle section of each said lead is entirely exposed out ofsaid body.
 17. An electronic package as claimed in claim 14, whereinsaid top end of each said lead is at least partially embedded in thebody.
 18. An electronic package as claimed in claim 14, wherein saidsubstrate includes first and second conductive layers on opposite topand bottom faces of said substrate; and at least one conductive viapenetrating the substrate to electrically connect the first and secondconductive layers; wherein said conductive via is disposed immediatelyunder the electronic element for dissipating heat generated by saidelectronic element away.
 19. An electronic package as claimed in claim14, further comprising: an insulating encapsulant encapsulating theelectronic element and disposed under the body.
 20. An electronicpackage as claimed in claim 19, wherein a width of said encapsulant issmaller than that of said body.
 21. An electronic package as claimed inclaim 20, wherein said encapsulant is disposed between the bottom endsof the leads.
 22. An electronic package as claimed in claim 14, whereinthe top end and bottom end of each said lead are positioned in parallelplanes and the middle section of said lead is perpendicular to the topend and the bottom end.
 23. An electronic package as claimed in claim14, wherein said electronic element is one selected from the groupconsisting of a capacitor, a resistor, and an inductor with a smallerinductance than the coil.
 24. An electronic package as claimed in claim14, wherein said electronic element is one selected from the groupconsisting of a metal-oxide-semiconductor field effect transistor(MOSFET), an insulated gate bipolar transistor (IGBT), and a diode. 25.An electronic package as claimed in claim 14, comprising multiple saidelectronic elements disposed under the body and between the bottom endsof the leads.
 26. An electronic package as claimed in claim 14, furthercomprising: an electromagnetic-interference (EMI) shielding elementbetween the coil and the electronic element.
 27. An electronic packageas claimed in claim 26, further comprising an insulating encapsulantencapsulating the electronic element and disposed under the body;wherein the EMI shielding element is embedded in the encapsulant.
 28. Anelectronic package as claimed in claim 26, wherein the EMI shieldingelement is embedded in the body.
 29. An electronic package as claimed inclaim 28, wherein the body includes a magnetic wrap that wraps the coil.